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What is a phenolic resin adhesive?
Release time:
2016-11-08
Phenolic resin Adhesive It is one of the earliest and most widely used types of synthetic resin adhesives, extensively applied in industries such as construction material processing and building engineering, coatings and plastics, aircraft, ships, automobiles and tractors, aerospace, and light industry. Phenolic resin adhesives boast advantages including high bonding strength, excellent resistance to high temperatures, water, and oils, low cost, ease of production, and inherent ease of modification. To date, in the field of synthetic adhesives, phenolic resin adhesives remain among the largest-volume products in absolute terms. In particular, modified phenolic resin adhesives occupy a critically important position. Since the raw materials for phenolic resin production are phenols and aldehydes—free phenols and aldehydes, especially free formaldehyde—are harmful to human health and the environment, their content must be strictly controlled. Consequently, phenolic resins that contain no free phenols or aldehydes, or contain them only in trace amounts, have been developed both domestically and internationally. Environmentally friendly modified phenolic resin products have also been developed at home and abroad.
There are many varieties of phenolic resin adhesives. Depending on the different raw materials used in synthesis, varying synthesis conditions and performance characteristics, as well as differing application requirements, classification methods also vary, making it difficult to establish a unified classification and nomenclature. Generally, they can be categorized into two major types: phenolic resin adhesives and modified phenolic resin adhesives. Alternatively, they can be classified according to the curing temperature at which the phenolic resin is used, including high-temperature-curing phenolic resin adhesives, medium-temperature-curing phenolic resin adhesives, and room-temperature-curing phenolic resin adhesives.
(1) High-temperature curing phenolic resin Adhesive When using a strong base as the catalyst, the reaction medium has a pH value greater than 10 and is cured at 130–150°C. When using a weak base as the catalyst, the reaction medium has a pH value below 9; the initial phenolic resin formed is dissolved in alcohol and then cured at 130–150°C.
(2) Medium-temperature curing phenolic resin Adhesive Using an alkali as a catalyst and with a reaction medium pH greater than 12, the polymerization is carried out in a reactor to reach a stage close to that of mid-stage resin, followed by curing at 105–115°C.
(3) Room-temperature curing phenolic resin adhesive, which uses a strong alkali as a catalyst to initially form phenolic resin, dissolves it in an organic solvent, and cures at room temperature under acidic conditions.
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